Micro-fabrication in IMSE Cleanroom

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Reactive Ion Etch(RIE)

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Oxford Instrument's Plasma Lab 100 System provides the capability to etch features on silicon wafers using plasma based gas chemistries. The instrument has dual source plasma: Inductive Couple Plasma (ICP) on top chamber and Reactive Ion Plasma source on Substrate. The tool has the ability to run ICP based deep Si etch processes. The standard gasses connected to the instrument are Ar, O2, He, CHF3, SF6, NF3, H2 and CH4.

IMSE Contact & Approved Trainer:
Rahul Gupta (rgupta24@wustl.edu)

Training Documents:
NOTE: User must demonstrate skills to IMSE staff before independent use.
Operating instructions

Click here to see the current recipes

Technical Info: