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PE 50 Asher, manufactured by Plasma Etch, uses Oxygen plasma to remove organic materials such as photoresist. It can be operated either in RIE mode or in soft Plasma Etching/Ashing mode. Other gases can be included to tweak etching/ashing performance. RF power of up to 100 W can be applied.
IMSE Contact & Approved Trainer:
Rahul Gupta (rgupta24@wustl.edu)
Training Documents:
NOTE: User must demonstrate skills to IMSE staff before independent use.
Operating instructions
Recipe:
N/A
Technical Info:
Instrument Specifications